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hwmon: (w83627ehf) Add support for W83667HG

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Add initial support for the Nuvoton W83667HG chip to the w83627ehf
driver. It has been tested on ASUS P5QL PRO by Gong Jun.

At the moment there is still a usability issue which is that only in6
or temp3 can be present on the W83667HG, so the driver shouldn't
expose both. This will be addressed later.

Signed-off-by: Gong Jun <JGong@nuvoton.com>
Acked-by: David Hubbard <david.c.hubbard@gmail.com>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
This commit is contained in:
Gong Jun
2009-03-30 21:46:42 +02:00
committed by Jean Delvare
parent 1704b26ee3
commit 237c8d2f54
3 changed files with 92 additions and 47 deletions
Download Patch File Download Diff File Expand all files Collapse all files

29
Documentation/hwmon/w83627ehf
View File

@@ -2,30 +2,40 @@ Kernel driver w83627ehf
=======================
Supported chips:
* Winbond W83627EHF/EHG/DHG (ISA access ONLY)
* Winbond W83627EHF/EHG (ISA access ONLY)
Prefix: 'w83627ehf'
Addresses scanned: ISA address retrieved from Super I/O registers
Datasheet:
http://www.winbond-usa.com/products/winbond_products/pdfs/PCIC/W83627EHF_%20W83627EHGb.pdf
DHG datasheet confidential.
http://www.nuvoton.com.tw/NR/rdonlyres/A6A258F0-F0C9-4F97-81C0-C4D29E7E943E/0/W83627EHF.pdf
* Winbond W83627DHG
Prefix: 'w83627dhg'
Addresses scanned: ISA address retrieved from Super I/O registers
Datasheet:
http://www.nuvoton.com.tw/NR/rdonlyres/7885623D-A487-4CF9-A47F-30C5F73D6FE6/0/W83627DHG.pdf
* Winbond W83667HG
Prefix: 'w83667hg'
Addresses scanned: ISA address retrieved from Super I/O registers
Datasheet: not available
Authors:
Jean Delvare <khali@linux-fr.org>
Yuan Mu (Winbond)
Rudolf Marek <r.marek@assembler.cz>
David Hubbard <david.c.hubbard@gmail.com>
Gong Jun <JGong@nuvoton.com>
Description
-----------
This driver implements support for the Winbond W83627EHF, W83627EHG, and
W83627DHG super I/O chips. We will refer to them collectively as Winbond chips.
This driver implements support for the Winbond W83627EHF, W83627EHG,
W83627DHG and W83667HG super I/O chips. We will refer to them collectively
as Winbond chips.
The chips implement three temperature sensors, five fan rotation
speed sensors, ten analog voltage sensors (only nine for the 627DHG), one
VID (6 pins for the 627EHF/EHG, 8 pins for the 627DHG), alarms with beep
warnings (control unimplemented), and some automatic fan regulation
strategies (plus manual fan control mode).
VID (6 pins for the 627EHF/EHG, 8 pins for the 627DHG and 667HG), alarms
with beep warnings (control unimplemented), and some automatic fan
regulation strategies (plus manual fan control mode).
Temperatures are measured in degrees Celsius and measurement resolution is 1
degC for temp1 and 0.5 degC for temp2 and temp3. An alarm is triggered when
@@ -54,7 +64,8 @@ follows:
temp1 -> pwm1
temp2 -> pwm2
temp3 -> pwm3
prog -> pwm4 (the programmable setting is not supported by the driver)
prog -> pwm4 (not on 667HG; the programmable setting is not supported by
the driver)
/sys files
----------